Apparatus and method of manufacturing a display device

ABSTRACT

An apparatus for manufacturing a display device includes a stage to support first and second members, and a pressurization portion spaced apart from the stage and to press the first or second member. The pressurization portion includes: a contact portion facing the stage and to contact the first or second member; a first force application unit connected to the contact portion and to linearly move the contact portion; and a second force application unit connected to the contact portion and spaced apart from the first force application unit. The second force application unit linearly moves the contact portion in a portion of the contact portion that is different from the portion contacted by the first force application unit. At least one of the first and second force application units is configured to operate according to a force applied by the contact portion to one of the first and second members.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to and the benefit of Korean PatentApplication No. 10-2021-0067584, filed May 26, 2021, which is herebyincorporated by reference for all purposes as if fully set forth herein.

BACKGROUND Field

One or more embodiments generally relate to apparatuses and methods, andmore particularly, to apparatuses and methods of manufacturing a displaydevice.

Discussion

Electronic devices based on mobility are widely used. In addition tosmall electronic devices, such as mobile phones, tablet personalcomputers (PCs) have recently been widely used as mobile electronicdevices. Such a mobile electronic device typically includes a displaydevice to support various functions and provide visual information, suchas an image or video, to a user. As other components for driving adisplay device have been miniaturized, the proportion occupied by adisplay device in electronic devices is gradually increasing, and astructure that is bendable to have a predetermined angle from a flatstate is growing in interest.

A film member may be attached to such a display device to protect adisplay panel or add various functions and the like. Furthermore, whenthe display panel is bent, a display circuit board may be fixed to thedisplay panel. In this state, it is a very important issue to attach thefilm member by applying uniform pressure. When a member is attached, ifa pressure is not applied uniformly, the member may be damaged or maynot be attached quickly and uniformly.

The above information disclosed in this section is only forunderstanding the background of the inventive concepts, and, therefore,may contain information that does not form prior art.

SUMMARY

One or more embodiments provide apparatuses and methods of manufacturinga display device, by which a first member and a second member may beuniformly attached on an entire surface.

Additional aspects will be set forth in the detailed description whichfollows, and, in part, will be apparent from the disclosure, or may belearned by practice of the inventive concepts.

According to an embodiment, an apparatus for manufacturing a displaydevice includes a stage and a pressurization portion. The stage isconfigured to support a first member and a second member. Thepressurization portion is spaced apart from the stage and configured topress the first member or the second member. The pressurization portionincludes a contact portion, a first force application unit, and a secondforce application unit. The contact portion faces the stage and isconfigured to contact the first member or the second member. The firstforce application unit is connected to the contact portion and isconfigured to linearly move the contact portion. The second forceapplication unit is connected to the contact portion and is spaced apartfrom the first force application unit. The second force application unitis configured to linearly move the contact portion in a portion of thecontact portion that is different from the portion contacted by thefirst force application unit. At least one of the first forceapplication unit and the second force application unit is configured tooperate according to a force applied by the contact portion to one ofthe first member and the second member.

According to an embodiment, a method of manufacturing a display deviceincludes arranging a first member and a second member on a stage;pressing one of the first member and the second member at at least twopositions on one surface of one of the first member and the secondmember; measuring forces applied to the at least two positions on theone surface of the one of the first member and the second member; andadjusting at least one of the forces applied to the at least twopositions on the one surface of the one of the first member and thesecond member to be within a range of a predetermined force based on theforces applied to the at least two positions on the one surface of theone of the first member and the second member.

According to an embodiment, a method of manufacturing a display deviceincludes: arranging a first member and a second member on a stage;pressing one of the first member and the second member at at least twopositions on one surface of one of the first member and the secondmember; and adjusting forces applied to the at least two positions onthe one surface of the one surface of the one of the first member andthe second member to be the same based on forces applied to the one ofthe first member and the second member.

One or more embodiments may be embodied using a system, a method, acomputer program, or any combination of a system, a method, and acomputer program.

The foregoing general description and the following detailed descriptionare illustrative and explanatory and are intended to provide furtherexplanation of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the inventive concepts, and are incorporated in andconstitute a part of this specification, illustrate embodiments of theinventive concepts, and, together with the description, serve to explainprinciples of the inventive concepts. In the drawings:

FIG. 1 is a perspective view of an apparatus for manufacturing a displaydevice according to an embodiment;

FIG. 2 is a perspective view of a linear driving portion and a detectionunit of FIG. 1 according to an embodiment;

FIG. 3A is a perspective view showing an operation of the apparatus formanufacturing a display device of FIG. 1 according to an embodiment;

FIG. 3B is a cross-sectional view of a display panel and a displaycircuit board taken along sectional line A-A′ of FIG. 3A according to anembodiment;

FIG. 3C is a cross-sectional view showing an operation of the apparatusfor manufacturing a display device of FIG. 1 according to an embodiment;

FIG. 3D is a cross-sectional view showing the operation of the apparatusfor manufacturing a display device of FIG. 1 ;

FIG. 4A is a cross-sectional view showing an operation of an apparatusfor manufacturing a display device according to an embodiment;

FIG. 4B is a cross-sectional view showing an operation of an apparatusfor manufacturing a display device according to an embodiment;

FIG. 5A is a cross-sectional view showing an operation of an apparatusfor manufacturing a display device according to an embodiment;

FIG. 5B is a cross-sectional view showing an operation of an apparatusfor manufacturing a display device according to an embodiment;

FIGS. 6A and 6B are plan views of a display device according to someembodiments;

FIG. 7 is a cross-sectional view of a display panel taken alongsectional line XI-XI′ of FIG. 6A or 6B according to an embodiment;

FIGS. 8A and 8B are circuit diagrams of the display device of FIG. 6A or6B according to some embodiments;

FIG. 9 is a cross-sectional view of the display device of FIG. 6A or 6Baccording to an embodiment;

FIG. 10 is a cross-sectional view of the display device of FIG. 6A or 6Baccording to an embodiment;

FIG. 11 is a cross-sectional view of the display device of FIG. 6A or 6Baccording to an embodiment;

FIG. 12 is a perspective view of a display panel and a film memberaccording to an embodiment;

FIG. 13 is a perspective view of a display panel and a film memberaccording to an embodiment; and

FIG. 14 is a perspective view of a display panel and a film memberaccording to an embodiment.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various embodiments. As used herein, the terms“embodiments” and “implementations” may be used interchangeably and arenon-limiting examples employing one or more of the inventive conceptsdisclosed herein. It is apparent, however, that various embodiments maybe practiced without these specific details or with one or moreequivalent arrangements. In other instances, well-known structures anddevices are shown in block diagram form to avoid unnecessarily obscuringvarious embodiments. Further, various embodiments may be different, butdo not have to be exclusive. For example, specific shapes,configurations, and characteristics of an embodiment may be used orimplemented in another embodiment without departing from the inventiveconcepts.

Unless otherwise specified, the illustrated embodiments are to beunderstood as providing example features of varying detail of someembodiments. Therefore, unless otherwise specified, the features,components, modules, layers, films, panels, regions, aspects, etc.(hereinafter individually or collectively referred to as an “element” or“elements”), of the various illustrations may be otherwise combined,separated, interchanged, and/or rearranged without departing from theinventive concepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. As such, thesizes and relative sizes of the respective elements are not necessarilylimited to the sizes and relative sizes shown in the drawings. When anembodiment may be implemented differently, a specific process order maybe performed differently from the described order. For example, twoconsecutively described processes may be performed substantially at thesame time or performed in an order opposite to the described order.Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element, it may be directly on,connected to, or coupled to the other element or intervening elementsmay be present. When, however, an element is referred to as being“directly on,” “directly connected to,” or “directly coupled to” anotherelement, there are no intervening elements present. Other terms and/orphrases used to describe a relationship between elements should beinterpreted in a like fashion, e.g., “between” versus “directlybetween,” “adjacent” versus “directly adjacent,” “on” versus “directlyon,” etc. Further, the term “connected” may refer to physical,electrical, and/or fluid connection. In addition, the X-axis, theY-axis, and the Z-axis are not limited to three axes of a rectangularcoordinate system, and may be interpreted in a broader sense. Forexample, the X-axis, the Y-axis, and the Z-axis may be perpendicular toone another, or may represent different directions that are notperpendicular to one another. For the purposes of this disclosure, “atleast one of X, Y, and Z” and “at least one selected from the groupconsisting of X, Y, and Z” may be construed as X only, Y only, Z only,or any combination of two or more of X, Y, and Z, such as, for instance,XYZ, XYY, YZ, and ZZ. As used herein, the term “and/or” includes any andall combinations of one or more of the associated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various elements, these elements should not be limited by theseterms. These terms are used to distinguish one element from anotherelement. Thus, a first element discussed below could be termed a secondelement without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one element's relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the term“below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing someembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various embodiments are described herein with reference to sectionalviews, isometric views, perspective views, plan views, and/or explodedillustrations that are schematic illustrations of idealized embodimentsand/or intermediate structures. As such, variations from the shapes ofthe illustrations as a result of, for example, manufacturing techniquesand/or tolerances, are to be expected. Thus, embodiments disclosedherein should not be construed as limited to the particular illustratedshapes of regions, but are to include deviations in shapes that resultfrom, for instance, manufacturing. To this end, regions illustrated inthe drawings may be schematic in nature and shapes of these regions maynot reflect the actual shapes of regions of a device, and, as such, arenot intended to be limiting.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and will not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

As customary in the field, some embodiments are described andillustrated in the accompanying drawings in terms of functional blocks,units, and/or modules. Those skilled in the art will appreciate thatthese blocks, units, and/or modules are physically implemented byelectronic (or optical) circuits, such as logic circuits, discretecomponents, microprocessors, hard-wired circuits, memory elements,wiring connections, and the like, which may be formed usingsemiconductor-based fabrication techniques or other manufacturingtechnologies. In the case of the blocks, units, and/or modules beingimplemented by microprocessors or other similar hardware, they may beprogrammed and controlled using software (e.g., microcode) to performvarious functions discussed herein and may optionally be driven byfirmware and/or software. It is also contemplated that each block, unit,and/or module may be implemented by dedicated hardware, or as acombination of dedicated hardware to perform some functions and aprocessor (e.g., one or more programmed microprocessors and associatedcircuitry) to perform other functions. Also, each block, unit, and/ormodule of some embodiments may be physically separated into two or moreinteracting and discrete blocks, units, and/or modules without departingfrom the inventive concepts. Further, the blocks, units, and/or modulesof some embodiments may be physically combined into more complex blocks,units, and/or modules without departing from the inventive concepts.

Hereinafter, various embodiments will be explained in detail withreference to the accompanying drawings.

FIG. 1 is a perspective view of an apparatus 100 for manufacturing adisplay device according to an embodiment. FIG. 2 is a perspective viewof a linear driving portion and a detection unit of FIG. 1 according toan embodiment.

Referring to FIGS. 1 and 2 , the apparatus 100 for manufacturing adisplay device may include a base portion 110, a stage driving portion120, a movement portion 130, a stage 140, a pressurization portion 170,a support portion 150, and a position adjustment portion 160.

The base portion 110 may be arranged on a structure, such as an externalbuilding, machine tool, and/or the like. In this state, the base portion110 may be in the form of a plate, or a form in which a plurality offrames is combined with each other in a lattice form.

The stage driving portion 120 may be arranged on the base portion 110and may linearly move the movement portion 130 and the stage 140 in afirst direction, for example, a Y-axis direction of FIG. 1 . The stagedriving portion 120 may have various shapes. In an embodiment, the stagedriving portion 120 may include a linear motor to linearly move themovement portion 130 placed on the stage driving portion 120. In anotherembodiment, the stage driving portion 120 may include a cylinderconnected to the movement portion 130 and a linear guide guiding themovement portion 130 placed on the linear guide to linearly move. Inanother embodiment, the stage driving portion 120 may include a ballscrew connected to the movement portion 130 and a motor connected to theball screw. In this state, the stage driving portion 120 is not limitedthereto, and may include all apparatuses and structures arranged on thebase portion 110 to linearly move the movement portion 130.

The movement portion 130 may be placed on the stage driving portion 120and may perform a linear motion in the length direction of the stagedriving portion 120, for example, the Y-axis direction of FIG. 1 . Inthis state, various apparatuses may be arranged in the movement portion130. For example, a pump and/or the like that communicates with asuction hole 141 formed in the stage 140 may be arranged in the movementportion 130. Furthermore, various cables and/or the like may be arrangedin the movement portion 130.

The stage 140 may be placed on the movement portion 130 and may movetogether during the movement of the movement portion 130. In this state,the stage 140 may be formed in the form of a plate and may have a flowpath therein. The flow path may be connected to the pump arranged insideor outside the movement portion 130. Furthermore, the flow path may beconnected to the suction hole 141 arranged on the upper surface of thestage 140. The suction hole 141 may include a plurality of suction holesthat are provided in the upper surface of the stage 140 apart from eachother. In this state, the suction holes 141 may be arranged apart fromeach other at regular intervals.

The pressurization portion 170 may be arranged apart from the stage 140.In this state, the pressurization portion 170 may press a member placedon the stage 140. The pressurization portion 170 may include a pluralityof force application units and a plurality of detection units. In thisstate, each of the detection units may be arranged to correspond to eachof the force application units.

The force application units may have various shapes. For example, eachof the force application units may include a pneumatic and/or hydrauliccylinder. In another embodiment, each of the force application units mayinclude a servo motor.

The detection units may have various shapes. For example, each of thedetection units may include a pressure sensor that measures an appliedpressure. In another embodiment, each of the detection units may includea load cell. In another embodiment, each of the detection units mayinclude an electronic pressure sensitive paper. In the followingdescription, for convenience of explanation, a case in which each of thedetection units is a load cell is mainly described in more detail.

The force application units may include a first force application unit172 a and a second force application unit. In this state, the secondforce application unit may include a second-1 force application unit 172b-1, a second-2 force application unit 172 b-2, a second-3 forceapplication unit 172 b-3, and a second-4 force application unit 172 b-4,which are arranged apart from each other with respect to the first forceapplication unit 172 a. In this case, the second-1 force applicationunit 172 b-1 and the second-2 force application unit 172 b-2 may bearranged symmetrically with respect to the first force application unit172 a. Furthermore, the second-1 force application unit 172 b-1 and thesecond-3 force application unit 172 b-3 may be arranged symmetricallywith respect to the first force application unit 172 a, and the second-2force application unit 172 b-2 and the second-4 force application unit172 b-4 may be arranged symmetrically with respect to the first forceapplication unit 172 a. The second-1 force application unit 172 b-1 andthe second-4 force application unit 172 b-4, and the second-2 forceapplication unit 172 b-2 and the second-3 force application unit 172b-3, may be arranged symmetrically with respect to the first forceapplication unit 172 a. In this case, the first force application unit172 a may be arranged at the center of the pressurization portion 170.

The number of second force application units is not limited to the abovedescription. For example, the second force application unit may includetwo second force application units, which are arranged symmetricallywith respect to the first force application unit 172 a. In this state,the two second force application units and the first force applicationunit 172 a may be arranged in a row, and may be arranged on a straightline passing the center of the pressurization portion 170. The secondforce application unit described as above may include even-numberedsecond force application units. In the following description, forconvenience of explanation, a case in which the second force applicationunit includes four second force application units is described in moredetail.

The detection units may include a first detection unit 172 a-1 connectedto the first force application unit 172 a and a second detection unitconnected to the second force application unit. In this state, thenumber of second detection units is the same as the number of secondforce application units, and the second detection units may be arrangedcorresponding to the positions of the second force application units.

In the above case, the second detection units may include a second-1detection unit 172 c-1 arranged corresponding to the second-1 forceapplication unit 172 b-1, a second-2 detection unit 172 c-2 arrangedcorresponding to the second-2 force application unit 172 b-2, a second-3detection unit 172 c-3 arranged corresponding to the second-3 forceapplication unit 172 b-3, and a second-4 detection unit 172 c-4 arrangedcorresponding to the second-4 force application unit 172 b-4. In thiscase, each detection unit may measure a force or pressure applied byeach of the force application units.

The support portion 150 may be connected to the pressurization portion170 to support the pressurization portion 170. In this state, thesupport portion 150 may include a first support portion 151 connected tothe base portion 110 and a second support portion 152 connected to thefirst support portion 151. As the first support portion 151 and thesecond support portion 152 are connected to each other in differentdirections, the pressurization portion 170 may be arranged over thestage 140.

The position adjustment portion 160 may connect the pressurizationportion 170 to the support portion 150, and may linearly move thepressurization portion 170 in a third direction, e.g., a Z-axisdirection of FIG. 1 . In this state, the position adjustment portion 160may include a position adjustment driving portion 161 and a guideportion 162. In this case, the position adjustment driving portion 161may have a shape similar to the stage driving portion 120 previouslydescribed. Furthermore, the guide portion 162 may be connected to thepressurization portion 170 to guide the movement of the pressurizationportion 170 during the movement of the pressurization portion 170. Forexample, the position adjustment driving portion 161 may include alinear motor, and the guide portion 162 may include a linear motionguide. In another embodiment, the guide portion 162 may include a ballscrew, and the position adjustment driving portion 161 may include amotor. In another embodiment, the guide portion 162 may include a rackgear, and the position adjustment driving portion 161 may include a spurgear and a motor.

In some embodiments, the apparatus 100 for manufacturing a displaydevice may separately include a control unit that controls the stagedriving portion 120, the stage 140, the position adjustment portion 160,and the pressurization portion 170. In this state, the control unit maybe connected to the stage driving portion 120, the stage 140, theposition adjustment portion 160, and the pressurization portion 170, ina wired or wireless manner, to control the stage driving portion 120,the stage 140, the position adjustment portion 160, and thepressurization portion 170.

The control unit may have various shapes. For example, the control unitmay include a circuit board, a personal computer, a mobile phone, and/orthe like. In this state, the control unit is not limited to the above,and may include all apparatuses and structures capable of controllingthe stage driving portion 120, the stage 140, the position adjustmentportion 160, and the pressurization portion 170 in response toexternally input signals.

In the following description, the operation of the apparatus 100 formanufacturing a display device will be described in more detail below.

FIG. 3A is a perspective view showing an operation of the apparatus 100for manufacturing a display device of FIG. 1 according to an embodiment.FIG. 3B is a cross-sectional view of a display panel 1 and a displaycircuit board 51 taken along sectional line A-A′ of FIG. 3A according toan embodiment.

Referring to FIGS. 3A and 3B, after a first member FM1 and a secondmember FM2 are arranged on the stage 140, the first member FM1 and thesecond member FM2 may be attached to each other via the pressurizationportion 170. In this state, when the first member FM1 and the secondmember FM2 are arranged on the stage 140, the pressurization portion 170may be disposed correspond to the position(s) of the first member FM1and the second member FM2.

The first member FM1 may be a display panel 1, and the second member FM2may be the display circuit board 51. The display panel 1 and the displaycircuit board 51 may be in a state in which a part of the displaycircuit board 51 is bent, and the bent part of the display circuit board51 is temporarily attached to a second surface 1-2 of the display panel1 by an adhesive member AH. In this case, a first surface 1-1 of thedisplay panel 1 may be a surface where a display area to be describedbelow is arranged to implement an image, and the second surface 1-2 ofthe display panel 1 may be a surface where the display area is notpresent. In another embodiment, the first member FM1 may be the displaypanel 1, and the second member FM2 may include a functional film such asa protection film, a polarized film, and the like. In anotherembodiment, the first member FM1 may be one part of a substrate of thedisplay panel 1, and the second member FM2 may be another part of thesubstrate of the display panel 1. However, in the following description,for convenience of explanation, a case in which the first member FM1 isthe display panel 1 and the second member FM2 is the display circuitboard 51 is described.

In the above case, the display circuit board 51 may be bent before orafter being placed on the stage 140. For instance, after an adhesivemember AH is arranged on the second surface 1-2 of the display panel 1,one surface of the display circuit board 51 may be attached to theadhesive member AH and the display circuit board 51 may be bent.

In the above case, the display panel 1 may be fixed in a state in whicha gas is sucked through the suction hole 141 of the stage 140. In thisstate, the gas is sucked only in the suction hole 141 where the displaypanel 1 is arranged, and the gas is not sucked in the other portion.

FIG. 3C is a cross-sectional view showing an operation of the apparatus100 for manufacturing a display device of FIG. 1 according to anembodiment.

Referring to FIG. 3C, after the first member FM1, the second member FM2,and the adhesive member AH are arranged on the stage 140 as describedabove, the first member FM1 or the second member FM2 may be pressedusing the pressurization portion 170. In this state, the pressurizationportion 170 may include a contact portion 171 connected to the firstforce application unit 172 a and the second force application unit, andthe contact portion 171 may come in contact with the first member FM1 orthe second member FM2. In the following description, a case in which thesecond member FM2 is arranged above the first member FM1 is described.

The contact portion 171 may include a first body member 171-1, a secondbody member 171-2, and an elastic member 171-3, which are stacked oneach other. The first body member 171-1 and the second body member 171-2each may include metal, and the elastic member 171-3 may include anelastic material, such as at least one of silicon, rubber, syntheticresin, and the like. In this case, the elastic modulus of the first bodymember 171-1 may be greater than that of the second body member 171-2.Furthermore, the first body member 171-1 may be connected to the firstforce application unit 172 a, the second-1 force application unit 172b-1, the second-2 force application unit 172 b-2, the second-3 forceapplication unit 172 b-3, and the second-4 force application unit 172b-4, respectively, via the first detection unit 172 a-1, the second-1detection unit 172 c-1, the second-2 detection unit 172 c-2, thesecond-3 detection unit 172 c-3, and the second-4 detection unit 172c-4.

In the above case, when the first force application unit 172 a, thesecond-1 force application unit 172 b-1, the second-2 force applicationunit 172 b-2, the second-3 force application unit 172 b-3, and thesecond-4 force application unit 172 b-4 are operated, the contactportion 171 may descend to contact the second member FM2.

FIG. 3D is a cross-sectional view for showing an operation of theapparatus for manufacturing a display device of FIG. 1 according to anembodiment.

Referring to FIG. 3D, when the first force application unit 172 a, thesecond-1 force application unit 172 b-1, the second-2 force applicationunit 172 b-2, the second-3 force application unit 172 b-3, and thesecond-4 force application unit 172 b-4 are continuously operated tocontinuously descend the contact portion 171, the contact portion 171may press the second member FM2 to attach the first member FM1 and thesecond member FM2 with the adhesive member AH. In this case, the firstforce application unit 172 a, the second-1 force application unit 172b-1, the second-2 force application unit 172 b-2, the second-3 forceapplication unit 172 b-3, and the second-4 force application unit 172b-4 may press the second member FM2 in response to a preset signal viathe contact portion 171. The preset signal may be separately input by auser from the outside or an operation of each of the force applicationunits set according to a manufacturing process. For example, the presetsignal may be a force that is to be finally reached when each of theforce application units presses the second member FM2 through thecontact portion 171.

When each of the force application units is operated as described above,the first detection unit 172 a-1, the second-1 detection unit 172 c-1,the second-2 detection unit 172 c-2, the second-3 detection unit 172c-3, and the second-4 detection unit 172 c-4 may respectively measureforces applied to the first force application unit 172 a, the second-1force application unit 172 b-1, the second-2 force application unit 172b-2, the second-3 force application unit 172 b-3, and the second-4 forceapplication unit 172 b-4.

The force measured by each detection unit may be compared with a presetforce or a force detected by one of the detection units.

In more detail, in another embodiment, when the force measured by eachdetection unit is compared with a preset force, whether the forcemeasured by the detection unit is the same as or within a range based onthe preset force may be determined. For example, it may be determinedwhether the force detected by the first detection unit 172 a-1 is thesame as or within a range based on the preset force.

When the force detected by the first detection unit 172 a-1 is the sameas or within a range based on the preset force, the first forceapplication unit 172 a may maintain the state. For example, in anotherembodiment, when the first force application unit 172 a is a cylinder, apressure supplied to the cylinder may be maintained in the currentstate. In another embodiment, when the first force application unit 172a is a servo motor, a currently applied torque may be maintainedunchanged.

In contrast, when the force detected by the first detection unit 172 a-1is not the same as or is out of the range based on the preset force, theoperation of the first force application unit 172 a may be adjusted. Forexample, in another embodiment, when the first force application unit172 a is a cylinder, a pressure supplied to the cylinder may be adjustedto be more or less than that in the current state. In anotherembodiment, when the first force application unit 172 a is a servomotor, torque of the servo motor may be increased to be more ordecreased to be less than the current torque of the servo motor.

In another embodiment, when the rest of the force application units arecontrolled with respect to one force application unit thereof, a forceapplied to one force application unit may be compared with a forceapplied to each of the rest of the force application units. For example,when the first force application unit 172 a applies a force to thecontact portion 171, the force detected by the first detection unit 172a-1 may be used as a reference. In this state, it may be determinedwhether the forces detected by the second-1 detection unit 172 c-1, thesecond-2 detection unit 172 c-2, the second-3 detection unit 172 c-3,and the second-4 detection unit 172 c-4 are the same as or within arange based on the force detected by the first detection unit 172 a-1.Then, at least one of the second-1 force application unit 172 b-1, thesecond-2 force application unit 172 b-2, the second-3 force applicationunit 172 b-3, and the second-4 force application unit 172 b-4 may becontrolled such that the forces detected by the second-1 detection unit172 c-1, the second-2 detection unit 172 c-2, the second-3 detectionunit 172 c-3, and the second-4 detection unit 172 c-4 are the same as orwithin a range based on the force detected by the first detection unit172 a-1. In this state, as a method of controlling each of the forceapplication units is similar to the above description, a detaileddescription thereof is omitted.

The above operation may be continuously repeated while the second memberFM2 is pressed by the pressurization portion 170. In more detail, in theabove case, by individually controlling a plurality of force applicationunits, the force applied by the contact portion 171 to the second memberFM2 may be maintained as evenly as possible in the entire surface of thecontact portion 171. Furthermore, even when the level of the contactportion 171 or the stage 140 is not maintained, a uniform force may beapplied to the entire surface of the second member FM2 through the aboveoperation.

Thus, the apparatus 100 for manufacturing a display device and themethod of manufacturing a display device may uniformly attach the firstmember FM1 and the second member FM2.

FIG. 4A is a cross-sectional view for showing an operation of anapparatus for manufacturing a display device according to an embodiment.FIG. 4B is a cross-sectional view for showing the operation of anapparatus for manufacturing a display device according to an embodiment.

Referring to FIGS. 4A and 4B, the pressurization portion 170 may includea ball joint arranged between each force application unit and eachdetection unit.

For example, a first ball joint 172 a-2 may be arranged between thefirst force application unit 172 a and the first detection unit 172 a-1.In this state, the first force application unit 172 a may have acylinder shape, the first ball joint 172 a-2 may be arranged at a tipend of a cylinder, and the first ball joint 172 a-2 and the contactportion 171 may be connected to each other via the first detection unit172 a-1.

A second-1 ball joint 172 d-1 may be arranged between the second-1 forceapplication unit 172 b-1 and the second-1 detection unit 172 c-1, and asecond-3 ball joint 172 d-3 may be arranged between the second-3 forceapplication unit 172 b-3 and the second-3 detection unit 172 c-3. Inthis state, a second-2 ball joint may be arranged between a second-2force application unit and a second-2 detection unit, and a second-4ball joint may be arranged between a second-4 force application unit anda second-4 detection unit.

The pressurization portion 170 may be operated in a similar manner to asdescribed in association with FIGS. 3A to 3D. In this case, each balljoint connects each of the force application units to the contactportion 171 with a certain degree of allowance, and thus, even when thecontact portion 171 tilts or the stage 140 is out of balance, the lowersurface of the contact portion 171 may be in close contact with theupper surface of the second member FM2.

Furthermore, as each ball joint transfers a force according to theoperation of each of the force application units to the contact portion171 through a point contact between a ball structure and a housing inwhich the ball structure is accommodated, regardless of the arrangementof the force application units, the force may be transferred in adirection perpendicular to the upper surface or lower surface of thecontact portion 171.

FIG. 5A is a cross-sectional view for showing an operation of anapparatus for manufacturing a display device according to an embodiment.FIG. 5B is a cross-sectional view showing an operation of an apparatusfor manufacturing a display device according to an embodiment.

Referring to FIGS. 5A and 5B, the pressurization portion 170 may includea detection unit 172 c. In this state, the detection unit 172 c mayinclude an electronic pressure sensitive paper. The electronic pressuresensitive paper may be in the form of a sheet of paper or a plate. Inthis state, the detection unit 172 c may be arranged between the stage140 and one of the first member FM1 and the second member FM2, which islocated below. In another embodiment, the detection unit 172 c may bearranged on the lower surface of the contact portion 171. In thefollowing description, for convenience of explanation, a case in whichthe detection unit 172 c is arranged between the first member FM1 andthe stage 140 is described.

The detection unit 172 c may measure a pressure applied to each part ofthe second member FM2 when the contact portion 171 presses the secondmember FM2. The measured pressure may be converted to a force or used,as it is, as a base of controlling each of the force application units.

For example, the operation of the first force application unit 172 a maybe controlled based on the pressure applied by the first forceapplication unit 172 a. Furthermore, the operations of the second-1force application unit 172 b-1 and the second-3 force application unit172 b-3 may be detected based on the pressure applied by the second-1force application unit 172 b-1 and the second-3 force application unit172 b-3. In this state, the method of controlling each of the forceapplication units based on the measured pressure is the same as orsimilar to the method of controlling each of the force application unitsby measuring the force described above, and, as such, a detaileddescription thereof is omitted.

FIG. 6A is a plan view of a display device DP according to anembodiment.

Referring to FIG. 6A, the display device DP may include the displaypanel 1, the display circuit board 51, a display driving portion 52, anda touch sensor driving portion 53. The display panel 1 may include alight-emitting display panel including a light-emitting element. Forexample, the display panel 1 may include an organic light-emittingdisplay panel using an organic light-emitting diode including an organiclight-emitting layer, a micro light-emitting diode display panel using amicro light-emitting diode (LED), a quantum-dot light-emitting displaypanel using a quantum-dot light-emitting diode including a quantum-dotlight-emitting layer, or an inorganic light-emitting display panel usingan inorganic light-emitting element including an inorganicsemiconductor.

The display panel 1 may include a flexible display panel that is easilybendable, foldable, and/or rollable, but other deformations may beutilized in association with embodiments. For example, the display panel1 may include a foldable display panel that can be folded or unfolded, acurved display panel having a curved display surface, a bended displaypanel in which an area other than a display surface is bent, a rollabledisplay panel that can be rolled or unrolled, and a stretchable displaypanel that can be stretched, etc.

The display panel 1 may include a transparent display panel that isimplemented to be transparent so that an object or background located on(or behind) the lower surface of the display panel 1 can be seen fromthe upper surface of the display panel 1. As another example, thedisplay panel 1 may include a reflective display panel that can reflectan object or background of the upper surface of the display panel 1.

The display panel 1 may include a display area DA where an image isimplemented and a peripheral area NDA arranged to surround the displayarea DA. A separate driving circuit, a pad, and the like may be arrangedin the peripheral area NDA.

Furthermore, the display panel 1 may include a first area 1A arranged inthe display area DA, a bending area BA that is bent with respect to abending axis BAX, and a second area 2A that is connected to the bendingarea BA and to the display circuit board 51. In this case, the secondarea 2A and the bending area BA may be included in the peripheral areaNDA, and no image may be implemented therein.

The display circuit board 51 may be attached on or near one side edge ofthe display panel 1. One side of the display circuit board 51 may beattached on the one side edge of the display panel 1 using ananisotropic conductive film.

The display driving portion 52 may be arranged on the display circuitboard 51. The display driving portion 52 may receive control signals andpower voltages, and generate and output signals and voltages for drivingthe display panel 1. The display driving portion 52 may be formed as anintegrated circuit (IC).

The display circuit board 51 may be attached on the display panel 1. Inthis state, the display circuit board 51 and the display panel 1 may beattached to each other using an anisotropic conductive film. The displaycircuit board 51 may include a flexible printed circuit board (FPCB)that is bendable, or a composite printed circuit board including both ofthe FPCB and a rigid printed circuit board (RPCB) that is rigid and noteasily bent.

The touch sensor driving portion 53 may be arranged on the displaycircuit board 51. The touch sensor driving portion 53 may be formed asan integrated circuit (IC). The touch sensor driving portion 53 may beattached on the display circuit board 51. The touch sensor drivingportion 53 may be electrically connected to touch electrodes of atouchscreen layer of the display panel 1 via the display circuit board51.

The touchscreen layer of the display panel 1 may sense a touch input ofa user using at least one of various touch sensing methods, such as aresistive sensing method, a capacitive sensing method, an inductivesensing method, and/or the like. For example, when the touchscreen layerof the display panel 1 senses a user's touch input by a capacitivesensing method, the touch sensor driving portion 53 may apply drivingsignals to driving electrodes of the touch electrodes, sense voltagescharged in mutual capacitances between the driving electrodes and thesense electrodes, through the sense electrodes of the touch electrodes,thereby determining whether there is a user's touch. The user's touchmay include a contact touch and a proximity touch. The contact touchindicates that an object such as a user's finger, a pen, or the likedirectly contacts a cover member arranged on the touchscreen layer. Theproximity touch indicates that, like hovering, an object, such as auser's finger, a pen, or the like, is located closely apart from thecover member. The touch sensor driving portion 53 may transmit sensordata to a main processor according to the sensed voltages, and calculate(or determine) touch coordinates where a touch input is generated as themain processor analyzes the sensor data.

Pixels of the display panel 1, a scan driving portion, and a powersupply portion for supplying driving voltages to drive the displaydriving portion 52 may be additionally arranged on the display circuitboard 51. As another example, the power supply portion may be integratedwith the display driving portion 52, and in this case, the displaydriving portion 52 and the power supply portion may be formed as one IC.

FIG. 6B is a plan view of a display device according to an embodiment.

Referring to FIG. 6B, the display device DP may include the displaypanel 1, the display circuit board 51, the display driving portion 52,and the touch sensor driving portion 53. In this state, the displaypanel 1, the display driving portion 52, and the touch sensor drivingportion 53 may be similar to those described in association with FIG.6A.

The display panel 1 may include the display area DA and the peripheralarea NDA, the first area 1A in which the display area DA is arranged,the bending area BA that is bent, and the second area 2A connected tothe bending area BA. In this state, the bending area BA that isconnected to the first area 1A may be less than the length of one sideof the first area 1A. For example, the width of the bending area BAmeasured in the X-axis direction of FIG. 6B may decrease from the firstarea 1A toward the second area 2A and then may be constant in a certainarea.

The display circuit board 51 may be attached at or near one side edge ofthe display panel 1.

The display driving portion 52 may be arranged on the display circuitboard 51. The display driving portion 52 may receive control signals andpower voltages and generate and output signals and voltages to drive thedisplay panel 1. The display driving portion 52 may be formed as an IC.

In another embodiment, the display driving portion 52 may be arrangedon* (e.g., directly arranged on) a flexible film, and the displaycircuit board 51 and the display panel 1 may be connected to each otherthrough an anisotropic conductive film. One side of the flexible filmmay be attached on one side edge of the display panel 1 using theanisotropic conductive film. The flexible film may be a flexible filmthat is bendable.

The display circuit board 51 may be attached to the other side of thedisplay panel 1. The display circuit board 51 may include an FPCB thatis bendable, or a composite printed circuit board including both of theFPCB and a rigid PCB that is rigid and not easily bent.

FIG. 7 is a cross-sectional view of the display panel 1 taken alongsectional line XI-XI′ of FIG. 6A or 6B according to an embodiment.

Referring to FIG. 7 , the display panel 1 may include a substrate 10, abuffer layer 11, a circuit layer, and a display element layer, which arestacked.

As described above, the substrate 10 may an insulating material, such asinclude glass, quartz, polymer resin, and/or the like. The substrate 10may be a rigid substrate or a flexible substrate that is bendable,foldable, rollable, and/or the like.

A buffer layer 11 may be located on the substrate 10, reduce or blockinfiltration of a foreign material, moisture, and/or external air fromunder the substrate 10, and provide a planarized surface on thesubstrate 10. The buffer layer 11 may include an inorganic material,such as at least one of oxide or nitride, an organic material, and anorganic/inorganic complex, and have a single layer or multilayerstructure of an inorganic material and an organic material. A barrierlayer for blocking infiltration of external air may be further providedbetween the substrate 10 and the buffer layer 11. In some embodiments,the buffer layer 11 may include a silicon oxide (SiO₂) or a siliconnitride (SiN_(X)). The buffer layer 11 may include a first buffer layer11 a and a second buffer layer 11 b, which are stacked.

The circuit layer may be arranged on the buffer layer 11, and mayinclude a pixel circuit PC, a first gate insulating layer 12, a secondgate insulating layer 13, an interlayer insulating layer 15, and aplanarization layer 17. The pixel circuit PC may include a thin filmtransistor TFT and a storage capacitor Cst.

The thin film transistor TFT may be arranged above the buffer layer 11.The thin film transistor TFT may include a first semiconductor layer A1,a first gate electrode G1, a first source electrode S1, and a firstdrain electrode D1. The thin film transistor TFT may be connected to anorganic light-emitting diode OLED and may drive the organiclight-emitting diode OLED.

The first semiconductor layer A1 may be arranged on the buffer layer 11and may include poly silicon. In another embodiment, the firstsemiconductor layer A1 may include amorphous silicon. In anotherembodiment, the first semiconductor layer A1 may include oxide of atleast one material selected from the group consisting of indium (In),gallium (Ga), stannum (Sn), zirconium (Zr), vanadium (V), hafnium (Hf),cadmium (Cd), germanium (Ge), chromium (Cr), titanium (Ti), and zinc(Zn). The first semiconductor layer A1 may include a channel region, anda source region and a drain region into which impurities are doped.

The first gate insulating layer 12 may be provided to cover the firstsemiconductor layer A1. The first gate insulating layer 12 may includean inorganic insulating material, such as at least one of SiO₂, SiN_(x),a silicon oxynitride (SiON), an aluminum oxide (Al₂O₃), a titanium oxide(TiO₂), a tantalum oxide (Ta₂O₅), a hafnium oxide (HfO₂), a zinc oxide(ZnO_(x)), and the like. Here, the zinc oxide may be ZnO and/or ZnO₂.The first gate insulating layer 12 may be a single layer or multilayerincluding one or more of the above-described inorganic insulatingmaterials.

The first gate electrode G1 is arranged above the first gate insulatinglayer 12 to overlap the first semiconductor layer A1. The first gateelectrode G1 may include at least one of molybdenum (Mo), aluminum (Al),copper (Cu), Ti, and the like, and may be a single layer or multilayer.In an example, the first gate electrode G1 may be a single layer of Mo.

The second gate insulating layer 13 may be provided to cover the firstgate electrode G1. The second gate insulating layer 13 may include aninorganic insulating material, such as at least one of SiO₂, SiN_(x),SiON, Al₂O₃, TiO₂, Ta₂O₅, HfO₂, and ZnO_(x). Here, the zinc oxide may beZnO and/or ZnO₂. The second gate insulating layer 13 may be a singlelayer or multilayer including the above-described inorganic insulatingmaterial.

A first upper electrode CE2 of the storage capacitor Cst may be arrangedabove the second gate insulating layer 13.

In the display area DA, the first upper electrode CE2 may overlap thefirst gate electrode G1 thereunder. The first gate electrode G1 and thefirst upper electrode CE2, which overlap each other with the second gateinsulating layer 13 therebetween, may constitute the storage capacitorCst. The first gate electrode G1 may be a first lower electrode CE1 ofthe storage capacitor Cst.

The first upper electrode CE2 may include A1, platinum (Pt), palladium(Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium(Nd), iridium (Ir), Cr, calcium (Ca), Mo, Ti, tungsten (W), and/or Cu,and may be a single layer or multilayer of the above-described material.

The interlayer insulating layer 15 may cover the first upper electrodeCE2. The interlayer insulating layer 15 may include, for instance, atleast one of SiO₂, SiN_(x), SiON, Al₂O₃, TiO₂, Ta₂O₅, HfO₂, ZnO_(x), andthe like. Here, the zinc oxide may be ZnO and/or ZnO₂. The interlayerinsulating layer 15 may be a single layer or multilayer including theabove-described inorganic insulating material.

The first source electrode S1 and the first drain electrode D1 may bearranged on the interlayer insulating layer 15. The first sourceelectrode S1 and the first drain electrode D1 may include a conductivematerial including, for example, at least one of Mo, Al, Cu, Ti, and thelike, and may be a multilayer or single layer including the abovematerials. In an example, the first source electrode S1 and the firstdrain electrode D1 each may have a multilayer structure of Ti/Al/Ti.

The planarization layer 17 may be arranged to cover the first sourceelectrode S1 and the first drain electrode D1. The planarization layer17 may have a flat upper surface so that a pixel electrode 21 arrangedthereon may be formed to be flat.

The planarization layer 17 may include an organic material or aninorganic material, and have a single layer structure or a multilayerstructure. The planarization layer 17 may include a general purposepolymer, such as at least one of benzocyclobutene (BCB), polyimide,hexamethyldisiloxane (HMDSO), polymethylmethacrylate (PMMA), andpolystyrene, a polymer derivative having a phenolic group, acrylicpolymer, imide-based polymer, arylether-based polymer, amide-basedpolymer, fluorine-based polymer, p-xylene-based polymer, or vinylalcohol-based polymer, and/or the like. The planarization layer 17 mayinclude an inorganic insulating material, such as at least one of SiO₂,SiN_(x), SiON, Al₂O₃, TiO₂, Ta₂O₅, HfO₂, or ZnO_(x), and the like. Here,the zinc oxide may be ZnO and/or ZnO₂. When the planarization layer 17is formed, to provide a flat upper surface after forming a layer,chemical mechanical polishing may be performed on an upper surface ofthe layer.

The planarization layer 17 may have a via hole for exposing any one ofthe first source electrode S1 and the first drain electrode D1 of thethin film transistor TFT, and the pixel electrode 21 may contact thefirst source electrode S1 or the first drain electrode D1, through thevia hole, to be electrically connected to the thin film transistor TFT.

The pixel electrode 21 may include a conductive oxide, such as at leastone of an indium tin oxide (ITO), an indium zinc oxide (IZO), a zincoxide (ZnO), an indium oxide (In₂O₃), an indium gallium oxide (IGO), andan aluminum zinc oxide (AZO). The pixel electrode 21 may include areflective film including, for instance, at least one of Ag, Mg, Al, Pt,Pd, Au, Ni, Nd, Ir, and Cr, or any compound thereof. For example, thepixel electrode 21 may have a structure including films including ITO,IZO, ZnO, or In₂O₃ above/below the above-described reflective film. Inthis case, the pixel electrode 21 may have a stack structure of, forexample, ITO/Ag/ITO.

A pixel defining layer 19 may cover an edge of the pixel electrode 21above the planarization layer 17, and may have a first opening OP1 thatexposes a central portion of the pixel electrode 21. A light-emittingarea of the organic light-emitting diode OLED, e.g., the size and shapeof a subpixel, is defined by the first opening OP1.

The pixel defining layer 19 may increase a distance between the edge ofthe pixel electrode 21 and a counter electrode 23 above the pixelelectrode 21 to prevent generation of arc and the like at the edge ofthe pixel electrode 21. The pixel defining layer 19 may include anorganic insulating material, such as at least one of polyimide,polyamide, acryl resin, BCB, HMDSO, phenol resin, and the like, and maybe formed by a method, such as spin coating and/or the like.

A light-emitting layer 22 b, which is formed corresponding to the pixelelectrode 21, is arranged in the first opening OP1 of the pixel defininglayer 19. The light-emitting layer 22 b may include a polymer materialor a low molecular weight material, and emit red, green, blue, or whitelight, but embodiments are not limited thereto.

An organic functional layer 22 e may be arranged above and/or below thelight-emitting layer 22 b. The organic functional layer 22 e may includea first functional layer 22 a and/or a second functional layer 22 c. Thefirst functional layer 22 a or the second functional layer 22 c may beomitted.

The first functional layer 22 a may be arranged below the light-emittinglayer 22 b. The first functional layer 22 a may be a single layer ormultilayer of an organic material. The first functional layer 22 a maybe a hole transport layer (HTL) having a single layer structure.Alternatively, the first functional layer 22 a may include a holeinjection layer (HIL) and the HTL. The first functional layer 22 a maybe integrally formed to correspond to organic light-emitting diodes OLEDincluded in the display area DA, which may be disposed in a portion ofthe peripheral area NDA.

The second functional layer 22 c may be arranged above thelight-emitting layer 22 b. The second functional layer 22 c may be asingle layer or multilayer including an organic material. The secondfunctional layer 22 c may include an electron transport layer (ETL)and/or an electron injection layer (EIL). The second functional layer 22c may be integrally formed to correspond to organic light-emitting diodeOLEDs included in the display area DA.

The counter electrode 23 is arranged above the second functional layer22 c. The counter electrode 23 may include a conductive material havinga low work function. For example, the counter electrode 23 may include a(semi-)transparent layer including, for example, at least one of Ag, Mg,Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, lithium (Li), Ca, an alloy thereof, andthe like. Alternatively, the counter electrode 23 may further include alayer, such as at least one of ITO, IZO, ZnO, and In₂O₃ on the (semi-)transparent layer including the above-described material. The counterelectrode 23 may be integrally formed to correspond to the organiclight-emitting diodes OLEDs included in the display area DA.

Layers from the pixel electrode 21 to the counter electrode 23 formed inthe display area DA may constitute the organic light-emitting diodeOLED.

An upper layer 50 including an organic material may be formed on thecounter electrode 23. The upper layer 50 may be provided to protect thecounter electrode 23 and simultaneously increase light extractionefficiency. The upper layer 50 may include an organic material having ahigher refractive index than the counter electrode 23. Alternatively,the upper layer 50 may include stack layers having different refractiveindexes. For example, the upper layer 50 may include stack layers of ahigh refractive index layer/a low refractive index layer/a highrefractive index layer. The refractive index of the high refractiveindex layer may be about 1.7 or more, and the refractive index of thelow refractive index layer may be about 1.3 or less.

The upper layer 50 may additionally include LiF. Alternatively, theupper layer 50 may additionally include an inorganic insulatingmaterial, such as SiO₂ and/or SiN_(x). The upper layer 50 may be omittedas necessary. However, in the following description, for convenience ofexplanation, a case in which the upper layer 50 is arranged on thecounter electrode 23 is described.

In some embodiments, the display device DP may include a thin filmencapsulation layer that shields the upper layer 50.

The thin film encapsulation layer may be arranged on the upper layer 50to be in direct contact therewith. In this state, the thin filmencapsulation layer may cover parts of the display area DA and theperipheral area NDA to prevent infiltration of external moisture andoxygen. The thin film encapsulation layer may include at least oneorganic encapsulation layer and at least one inorganic encapsulationlayer. In the following description, for convenience of explanation, acase in which the thin film encapsulation layer includes a firstinorganic encapsulation layer, an organic encapsulation layer, and asecond inorganic encapsulation layer which are sequentially stacked onthe upper surface of the upper layer 50 is described.

In the above case, the first inorganic encapsulation layer may cover thecounter electrode 23, and include a silicon oxide, a silicon nitride, asilicon oxynitride, and/or the like. As the first inorganicencapsulation layer is formed along a structure thereunder, the uppersurface of the first inorganic encapsulation layer upper surface may notbe flat. The organic encapsulation layer may cover the first inorganicencapsulation layer, and unlike the first inorganic encapsulation layer,the upper surface of the organic encapsulation layer may beapproximately flat. For instance, the upper surface of the organicencapsulation layer may be approximately flat in a portion correspondingto the display area DA. The organic encapsulation layer may include oneor more materials selected from the group consisting of polyethyleneterephthalate, polyethylene naphthalate, polycarbonate, polyimide,polyethylene sulfonate, polyoxymethylene, polyarylate, and HMDSO. Thesecond inorganic encapsulation layer may cover the organic encapsulationlayer, and include at least one of silicon oxide, a silicon nitride, asilicon oxynitride, and the like.

A touchscreen layer may be arranged on the thin film encapsulationlayer.

FIGS. 8A and 8B are circuit diagrams of the display device of FIG. 6A or6B according to some embodiments.

Referring to FIGS. 8A and 8B, the pixel circuit PC may be connected to alight-emitting element ED, for example, the organic light-emitting diodeOLED of FIG. 7 , thereby implementing light emission of subpixels. Thepixel circuit PC may include a driving thin film transistor T1, aswitching thin film transistor T2, and the storage capacitor Cst. Theswitching thin film transistor T2 is connected to a scan line SL and adata line DL, and transmit a data signal Dm input through the data lineDL to the driving thin film transistor T1, in response to a scan signalSn input through the scan line SL.

The storage capacitor Cst is connected to the switching thin filmtransistor T2 and a driving voltage line PL, and stores a voltageequivalent to a difference between a voltage received from the switchingthin film transistor T2 and a driving voltage ELVDD supplied to thedriving voltage line PL.

The driving thin film transistor T1 is connected to the driving voltageline PL and the storage capacitor Cst, and may control a driving currentflowing from the driving voltage line PL to the light-emitting elementED corresponding to a voltage value stored in the storage capacitor Cst.The light-emitting element ED may emit light having a certain luminanceby the driving current.

Although FIG. 8A illustrates a case in which the pixel circuit PCincludes two thin film transistors and one storage capacitor, thedisclosure is not limited thereto.

Referring to FIG. 8B, the pixel circuit PC may include the driving thinfilm transistor T1, the switching thin film transistor T2, acompensation thin film transistor T3, a first initialization thin filmtransistor T4, an operation control thin film transistor T5, alight-emitting control thin film transistor T6, and a secondinitialization thin film transistor T7.

Although FIG. 8B illustrates a case in which signal lines SL, SL−1,SL+1, EL, and DL, an initialization voltage line VL, and the drivingvoltage line PL are provided for each pixel circuit PC, embodiments arenot limited thereto. For instance, in another embodiment, at least anyone of the signal lines SL, SL−1, SL+1, EL, and DL or/and theinitialization voltage line VL may be shared by neighboring pixelcircuits.

A drain electrode of the driving thin film transistor T1 may beelectrically connected to the light-emitting element ED via thelight-emitting control thin film transistor T6. The driving thin filmtransistor T1 receives the data signal Dm according to a switchingoperation of the switching thin film transistor T2 and supplies adriving current to the light-emitting element ED.

A gate electrode of the switching thin film transistor T2 is connectedto the scan line SL, and a source electrode thereof is connected to thedata line DL. A drain electrode of the switching thin film transistor T2is connected to a source electrode of the driving thin film transistorT1 and may be connected to the driving voltage line PL via the operationcontrol thin film transistor T5.

The switching thin film transistor T2 is turned on in response to thescan signal Sn received through the scan line SL and performs aswitching operation of transmitting the data signal Dm transmittedthrough the data line DL to the source electrode of the driving thinfilm transistor T1.

A gate electrode of the compensation thin film transistor T3 may beconnected to the scan line SL. A source electrode of the compensationthin film transistor T3 is connected to the drain electrode of thedriving thin film transistor T1 and to a pixel electrode of thelight-emitting element ED via the light-emitting control thin filmtransistor T6. A drain electrode of the compensation thin filmtransistor T3 may be connected to any one electrode of the storagecapacitor Cst, a source electrode of the first initialization thin filmtransistor T4 and a gate electrode of the driving thin film transistorT1. The compensation thin film transistor T3 is turned on in response tothe scan signal Sn received through the scan line SL, and connects thegate electrode of the driving thin film transistor T1 to the drainelectrode thereof, thereby diode-connecting the driving thin filmtransistor T1.

A gate electrode of the first initialization thin film transistor T4 maybe connected to a previous scan line SL-1. A drain electrode of thefirst initialization thin film transistor T4 may be connected to theinitialization voltage line VL. The source electrode of the firstinitialization thin film transistor T4 may be connected to any oneelectrode of the storage capacitor Cst, the drain electrode of thecompensation thin film transistor T3, and the gate electrode of thedriving thin film transistor T1. The first initialization thin filmtransistor T4 is turned on in response to a previous scan signal Sn−1received through the previous scan line SL−1, and may perform aninitialization operation to initialize a voltage of the gate electrodeof the driving thin film transistor T1 by transmitting an initializationvoltage Vint to the gate electrode of the driving thin film transistorT1.

A gate electrode of the operation control thin film transistor T5 may beconnected to a light-emitting control line EL. A source electrode of theoperation control thin film transistor T5 may be connected to thedriving voltage line PL. A drain electrode of the operation control thinfilm transistor T5 may be connected to the source electrode of thedriving thin film transistor T1 and the drain electrode of the switchingthin film transistor T2.

A gate electrode of the light-emitting control thin film transistor T6may be connected to the light-emitting control line EL. A sourceelectrode of the light-emitting control thin film transistor T6 may beconnected to the drain electrode of the driving thin film transistor T1and the source electrode of the compensation thin film transistor T3. Adrain electrode of the light-emitting control thin film transistor T6may be electrically connected to the pixel electrode of thelight-emitting element ED. The operation control thin film transistor T5and the light-emitting control thin film transistor T6 aresimultaneously (or substantially simultaneously) turned on in responseto a light-emitting control signal En received through thelight-emitting control line EL, and transmit the driving voltage ELVDDto the light-emitting element ED, and thus the driving current flows inthe light-emitting element ED.

A gate electrode of the second initialization thin film transistor T7may be connected to a next scan line SL+1. A source electrode of thesecond initialization thin film transistor T7 may be connected to thepixel electrode of the light-emitting element ED. A drain electrode ofthe second initialization thin film transistor T7 may be connected tothe initialization voltage line VL. The second initialization thin filmtransistor T7 is turned on in response to a next scan signal Sn+1received through the next scan line SL+1, and may initialize the pixelelectrode of the light-emitting element ED.

Although FIG. 8B illustrates a case in which the first initializationthin film transistor T4 and the second initialization thin filmtransistor T7 are respectively connected to the previous scan line SL−1and the next scan line SL+1, embodiments are not limited thereto. Forexample, in another embodiment, the first initialization thin filmtransistor T4 and the second initialization thin film transistor T7 bothare connected to a previous scan line SLn−1, and may be driven by theprevious scan signal Sn−1.

The other electrode of the storage capacitor Cst may be connected to thedriving voltage line PL. Any one electrode of the storage capacitor Cstmay be connected to the gate electrode of the driving thin filmtransistor T1, the drain electrode of the compensation thin filmtransistor T3, and the source electrode of the first initialization thinfilm transistor T4.

A counter electrode, for example, the cathode, of the light-emittingelement ED may receive a common voltage ELVSS. The light-emittingelement ED may emit light by receiving the driving current from thedriving thin film transistor T1.

The pixel circuit PC is not limited to the number and circuit design ofthe thin film transistor and the storage capacitor described withreference to FIGS. 8A and 8B, and the number and circuit design thereofmay be variously changed.

FIG. 9 is a cross-sectional view of the display device of FIG. 6A or 6Baccording to an embodiment.

Referring to FIG. 9 , when the display panel 1 is bent, the adhesivemember AH may be arranged on the substrate 10 of the display panel 1.For instance, as the adhesive member AH is arranged in a portion wherethe substrate 10 is bent, one surface of the first area 1A of thedisplay panel 1 and one surface of the second area 2A thereof areattached on the adhesive member AH and fixed thereon.

In another embodiment, a protection film 75 is arranged on the substrate10, and the protection film 75 of the first area 1A and the protectionfilm 75 of the second area 2A may be fixedly attached to each otherthrough the adhesive member AH. In the following description, forconvenience of explanation, a case in which the protection film 75 isarranged on the substrate 10 and the protection film 75 of the firstarea 1A and the protection film 75 of the second area 2A are attached onthe adhesive member AH is described.

The protection film 75 may include a protection film base 70 and anadhesive layer 80. In this state, the protection film base 70 mayinclude at least one of polyethylene terephthalate (PET) and polyimide(PI). Furthermore, the adhesive layer 80 may include various adhesivematerials. In this state, the adhesive layer 80 may be arranged on theentire surface of the substrate 10, and the protection film base 70 maybe arranged on the adhesive layer 80 and then partially removed to forman opening portion 750P. In another embodiment, a part of the protectionfilm base 70 and a part of the adhesive layer 80 may be removed to formthe opening portion 750P. In this state, both of the protection filmbase 70 and the adhesive layer 80 may not be present in the openingportion 750P.

The substrate 10 may be bent in the bending area BA. As the protectionfilm base 70 of the protection film 75 protects the lower surface of thesubstrate 10, the protection film base 70 may have stiffness.Accordingly, when the flexibility of the protection film base 70 is low,delamination may be generated between the protection film base 70 andthe substrate 10 as the substrate 10 is bent. However, in the displaydevice according to various embodiments, the protection film 75 havingthe opening portion 750P corresponding to the bending area BA mayeffectively prevent (or at least mitigate) the generation ofdelamination.

As such, although the protection film 75 has the opening portion 750Pcorresponding to the bending area BA and the protection film 75 isattached on the lower surface of the substrate in the first area 1A andthe second area 2A, the disclosure is not limited thereto. For example,the protection film 75 may correspond to only at least a part of thefirst area 1A of the substrate 10. For instance, the protection film 75may not be present in the second area 2A of the substrate 10.

Furthermore, according to one or more embodiments, the substrate 10 isbent around a bending axis such that a part of the lower surface of thefirst area 1A and a part of the lower surface of the second area 2A faceeach other, but embodiments are not limited thereto. For example,various modifications are possible such that the lower surface in thesecond area 2A does not face the lower surface in the first area 1A, andthe like because a curvature in the bending area BA is small comparedwith that illustrated in the drawings, or the area of the bending areaBA is small even when the curvature in the bending area BA has no muchchange.

In the above case, as described above, the substrate 10 may bend thedisplay circuit board 51 in a state in which a tension is generated tothe display circuit board 51.

In the above case, a part of the substrate 10 and a part of theprotection film 75 may constitute the first member FM1, and the otherpart of the substrate 10 and the other part of the protection film 75,and the display circuit board 51 may constitute the second member FM2.In this case, on the stage 140 of FIG. 1 , with respect to FIG. 9 , onesurface of the substrate 10 arranged in the first area 1A may be placedon the upper surface of the stage 140.

FIG. 10 is a cross-sectional view of the display device of FIG. 6A or 6Baccording to an embodiment.

Referring to FIG. 10 , after the substrate 10 and the like is bent, acushion layer 91 may be further arranged in an area where the first area1A and the second area 2A face each other. For example, the cushionlayer 91 may be arranged in a portion of the first area 1A of theprotection film base 70 and the second area 2A of the protection filmbase 70, in contact therewith. After the substrate 10 and the like isbent, the cushion layer 91 may be arranged in a space in which the firstarea 1A is separated apart from the second area 2A and may support thedisplay panel 1 and absorb an impact. The cushion layer 91 may includean elastic material. In this state, the display device is not limited tothe above, and the cushion layer 91 may be attached on the protectionfilm base 70 before being bent.

In the above case, the adhesive member AH is arranged between thecushion layer 91 and the protection film base 70 of the second area 2Aand fixes the cushion layer 91 and the protection film base 70.

In the above case, as described above, the substrate 10 may rotate andbend the display circuit board 51 in a state in which a tension isgenerated in the display circuit board 51.

In the above case, a part of the substrate 10, a part of the protectionfilm 75, and the cushion layer 91 may constitute the first member FM1,and the other part of the substrate 10, the other part of the protectionfilm 75, and the display circuit board 51 may constitute the secondmember FM2. In this case, on the stage 140 of FIG. 1 , with respect toFIG. 9 , one surface of the substrate 10 arranged in the first area 1Amay be placed on the upper surface of the stage 140.

FIG. 11 is a cross-sectional view of the display device of FIG. 6A or 6Baccording to an embodiment.

Referring to FIG. 11 , the display device DP may further include afilling material 93 arranged in the opening portion 750P. The fillingmaterial 93 may be used with the cushion layer 91. In this case, thefilling material 93 and the cushion layer 91 may be arranged afterbending. In another embodiment, the filling material 93 and the cushionlayer 91 are arranged before bending, and then the substrate 10 may bebent. In this state, the disclosure is not limited to the above, and thefilling material 93 and the cushion layer 91 may be arranged in variousways.

As described above, the adhesive member AH is arranged on the cushionlayer 91, and thus, the cushion layer 91 may be fixed on the protectionfilm base 70 of the second area 2A by the adhesive member AH.

In the above case, as described above, the substrate 10 may rotate andbend the display circuit board 51 in a state in which a tension isgenerated in the display circuit board 51.

In the above case, a part of the substrate 10, a part of the protectionfilm 75 and cushion layer 91 may constitute the first member FM1, andthe other part of the substrate 10, the other part of the protectionfilm 75, and the display circuit board 51 may constitute the secondmember FM2. In this case, on the stage 140 of FIG. 1 , with respect toFIG. 11 , one surface of the substrate 10 arranged in the first area 1Amay be placed on the upper surface of the stage 140.

FIG. 12 is a perspective view of the display panel 1 and a film memberPF according to an embodiment.

Referring to FIG. 12 , the film member PF may be attached on the displaypanel 1. In this state, the film member PF may be attached on the lowersurface of the display panel 1. In this case, the film member PF may bearranged in a portion of the display panel 1 where a display area is notarranged, to protect the lower surface of the display panel 1. Theadhesive member AH may be arranged between the film member PF and thedisplay panel 1.

In the above case, on the stage 140 of FIG. 1 , the film member PF maybe arranged as the first member FM1, and the display panel 1 arranged onthe film member PF may constitute the second member FM2 that the contactportion 171 contacts.

FIG. 13 is a perspective view of the display panel 1 and the film memberPH according to an embodiment.

Referring to FIG. 13 , the film member PF may be attached on the displaypanel 1. In this state, the film member PF may be attached on the uppersurface of the display panel 1. In this case, the film member PF may bearranged on the upper surface of the display panel 1 where the displayarea is arranged, to protect the upper surface of the display panel 1.In another embodiment, the film member PF may include various memberssuch as a polarized film, an optical functional layer, and the like. Theadhesive member AH may be arranged between the film member PF and thedisplay panel 1.

In the above case, on the stage 140 of FIG. 1 , the display panel 1 maybe arranged as the first member FM1, and the film member PF arranged onthe display panel 1 may constitute the second member FM2 that thecontact portion 171 contacts.

FIG. 14 is a perspective view of the display panel 1 and the film memberPF according to an embodiment.

Referring to FIG. 14 , the film member PF may be arranged and attachedon both surfaces of the display panel 1. In this case, the film memberPF arranged on the lower surface of the display panel 1 may be arrangedon the stage 140 of FIG. 1 . In this state, the adhesive member AH, thedisplay panel 1, the adhesive member AH, and the film member PF aresequentially arranged above the film member PF, and may be attached toeach other by pressurizing the same by the above-described method.

According to various embodiments, during attachment of a member, themember may be attached with a uniform force in the entire surface.According to various embodiments, irregularity of a force may be solvedby sensing the same in real time. According to the various embodiments,different members may be attached to each other through precisecompression.

Although certain embodiments and implementations have been describedherein, other embodiments and modifications will be apparent from thisdescription. Accordingly, the inventive concepts are not limited to suchembodiments, but rather to the broader scope of the accompanying claimsand various obvious modifications and equivalent arrangements as wouldbe apparent to one of ordinary skill in the art.

What is claimed is:
 1. An apparatus for manufacturing a display device,the apparatus comprising: a stage configured to support a first memberand a second member; and a pressurization portion spaced apart from thestage, the pressurization portion being configured to press the firstmember or the second member, wherein the pressurization portioncomprises: a contact portion facing the stage, the contact portion beingconfigured to contact the first member or the second member; a firstforce application unit connected to the contact portion, the first forceapplication unit being configured to linearly move the contact portion;and a second force application unit connected to the contact portion andspaced apart from the first force application unit, the second forceapplication unit being configured to linearly move the contact portionin a portion of the contact portion that is different from the portioncontacted by the first force application unit, and wherein at least oneof the first force application unit and the second force applicationunit is configured to operate according to a force applied by thecontact portion to one of the first member and the second member.
 2. Theapparatus of claim 1, wherein: the second force application unitcomprises a plurality of second force application units; and theplurality of second force application units is arranged symmetricallywith respect to the first force application unit.
 3. The apparatus ofclaim 1, wherein the pressurization portion further comprises: a firstdetection unit arranged between the first force application unit and thecontact portion, the first detection unit being configured to measure apressure applied by the first force application unit to the contactportion; and a second detection unit arranged between the second forceapplication unit and the contact portion, the second detection unitbeing configured to measure a pressure applied by the second forceapplication unit to the contact portion.
 4. The apparatus of claim 1,wherein the pressurization portion further comprises: a detection unitarranged between the contact portion and one of the first member and thesecond member or between the contact portion and each of the first forceapplication unit and the second force application unit, the detectionunit being configured to measure a pressure applied to a portion of thecontact portion.
 5. The apparatus of claim 1, further comprising: astage driving portion connected to the stage, the stage driving portionbeing configured to linearly move the stage.
 6. The apparatus of claim1, wherein, when a first force applied by the first force applicationunit to the contact portion and a second force applied by the secondforce application unit to the contact portion are different from eachother, at least one of the first force application unit and the secondforce application unit is configured to be operated such that the firstforce and the second force become the same.
 7. The apparatus of claim 1,wherein the contact portion comprises: a first body member connected tothe first force application unit and the second force application unit;and a second body member arranged below the first body member, thesecond body member having an elastic modulus different from an elasticmodulus of the first body member.
 8. The apparatus of claim 7, whereinthe elastic modulus of the first body member is greater than the elasticmodulus of the second body member.
 9. The apparatus of claim 7, whereinthe contact portion further comprises an elastic member arranged belowthe second body member.
 10. The apparatus of claim 1, furthercomprising: a stage driving portion on which the stage is disposed, thestage driving portion being configured to linearly move the stage. 11.The apparatus of claim 1, wherein each of the first force applicationunit and the second force application unit comprises a ball jointconnected to the contact portion.
 12. A method of manufacturing adisplay device, the method comprising: arranging a first member and asecond member on a stage; pressing one of the first member and thesecond member at at least two positions on one surface of one of thefirst member and the second member; measuring forces applied to the atleast two positions on the one surface of the one of the first memberand the second member; and adjusting at least one of the forces appliedto the at least two positions on the one surface of the one of the firstmember and the second member to be within a range of a predeterminedforce based on the forces applied to the at least two positions on theone surface of the one of the first member and the second member. 13.The method of claim 12, further comprising: arranging the first memberand the second member in a row; and bending one of the first member andthe second member.
 14. The method of claim 12, further comprising:linearly moving the stage.
 15. The method of claim 12, wherein: thefirst member is a display panel; and the second member is a displaycircuit board.
 16. The method of claim 12, wherein: the first member isa part of a substrate of a display panel; and the second member isanother part of the substrate of the display panel.
 17. The method ofclaim 12, further comprising: arranging an adhesive member between thefirst member and the second member.
 18. The method of claim 12, whereinforces applied to one of the first member and the second member areapplied symmetrically with respect to a center of one of the firstmember and the second member.
 19. The method of claim 12, furthercomprising: arranging a detection unit for measuring the forces above orbelow one of the first member and the second member.
 20. A method ofmanufacturing a display device, the method comprising: arranging a firstmember and a second member on a stage; pressing one of the first memberand the second member at at least two positions on one surface of one ofthe first member and the second member; and adjusting forces applied tothe at least two positions on the one surface of the one surface of theone of the first member and the second member to be the same based onforces applied to the one of the first member and the second member.